Laser Lift-Off (LLO) allows the clean, contactless separation of thin films from their substrates. Ideal for flexible electronics, displays, and advanced semiconductors, this UV laser process boosts production yield while reducing stress, contamination, and material loss.
Precision layer release without contact
Clean separation for fragile layers.
Thin-film electronics depend on precise, damage-free detachment. Our Laser Lift-Off process releases layers without mechanical contact, reducing stress and defects while supporting higher yields across flexible, delicate and next-generation device architectures.
Clean precision for the future of electronics
From microLEDs to flexible OLEDs, Laser Lift-Off is shaping the future of next-gen device manufacturing.
Non-contact and contamination-free process
Minimizes mechanical and thermal stress
Supports flexible, fragile, or thin-film materials
High productivity with scalable wafer-to-panel formats
Adjustable laser parameters for different film/substrate combinations
Excimer laser: superior beam homogeneity for flawless and reliable debonding.
The tools that turn ideas into results
From ultrafast cutting to advanced surface processing, our machines deliver industrial performance with micrometre accuracy. Explore the systems trusted by leading manufacturers for speed, stability, and repeatable quality.
Software that lets your process shine
Our control software brings clarity to complex workflows, with intuitive tools for parameter tuning, automation and real-time monitoring. Everything you need to run high-precision laser processes with confidence.
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