One technology, engineered for two world

Electronics

The electronics business

Engineered for precision, performance and reliability

In this fast-moving sector, production is continuous and depends on uninterrupted equipment performance. In short, manufacturers must achieve micron-level accuracy and flawless results while maintaining maximum uptime and repeatability. With a focus on process reliability and scalable output, LASEA’s laser systems enable electronics leaders to meet market demands confidently and sustain consistent, high productivity.

Focus on semiconductors

Ultra-precise. Ultra-reliable. Ultra-clean.

In semiconductors, perfection is the only standard. Equipment must operate continuously, delivering micron-level accuracy and repeatable results in cleanroom environments where uptime exceeds 99.9%. LASEA’s laser systems master these conditions, ensuring defect-free machining, consistent performance, and effortless automation integration.
Burr-free precision on delicate or layered substrates ensures accuracy without compromise. Reliability is engineered into every component, guaranteeing stable performance across every shift. And with cleanroom-ready designs, each system fits seamlessly into advanced production lines.

compress

Through Glass Via (TGV) drilling for advanced packaging


texture

Micro-welding of glass-to-silicon and copper-to-silicon


device_thermostat

Functional surface texturing for heat management


360

Turning of micro pins and probes


draw

Selective marking and engraving

Focus on other electronics

Engineered for performance and low total cost of ownership

Electronics manufacturing is nonstop, and every minute counts. Manufacturers must balance precision and productivity while keeping downtime and defects to a minimum. LASEA’s scalable laser systems combine process reliability, yield, and efficiency across battery, photovoltaic, and packaging applications. High-speed laser processes keep productivity at peak, even in 24/7 production environments. Modular, automation-ready platforms scale effortlessly with growing demand. And contactless operation reduces maintenance, consumables, and energy use for a lower total cost of ownership.

Precision cutting

for micro-batteries

Decoating and wire stripping

Selective marking and engraving

Clients in

35+ countries

Used in 24/7 production lines

The perfect outcome every time

Accuracy without compromise

LASEA combines fine laser control with industrial-scale performance, helping manufacturers lower cost per part, improve yield, and sustain round-the-clock production. Precision remains constant, even as throughput increases, delivering consistent quality, minimal waste, and zero compromise on speed.

Precision machining

Precision tools for advanced manufacturing

Every LASEA system is engineered for low thermal impact, cleanroom compatibility, and easy integration with high-mix production lines.

Processes

What we deliver

Tailored systems for advanced semiconductor or hybrid processes, designed to meet the most demanding precision and cleanroom requirements.

Debonding

Laser Lift-Off (LLO) enables the clean, precise separation of thin functional layers from transparent substrates – ideal for flexible electronics, displays, and microfabrication.

Decoating

From microelectronics to luxury packaging, laser decoating provides a fast, clean, and selective way to remove surface layers, without damaging the substrate. Whether for aesthetics or performance, the results are high quality, stress-free, and repeatable.

Wire stripping

Laser wire stripping removes insulation from ultra-fine wires with surgical precision – no contact, no blade marks, no damage. Perfect for sensitive applications in medical and electronic assemblies.

Welding

Laser welding delivers high-precision, non-contact joining – ideal for miniature or sensitive components across luxury, medical, electronic, and aerospace applications. From fine seams to complex material pairings, laser welding ensures clean, strong, and consistent results where traditional methods fall short.

Cutting

From sapphire to stainless steel, our laser cutting processes deliver burr-free, contactless results across all materials – hard, fragile, or soft. Fine edges, tight tolerances, and complex geometries come standard.

Drilling

From injectors to microelectronic components, laser drilling delivers fast, accurate results across all materials. Clean holes, straight walls, zero contact.

Engraving

From decorative detailing to industrial-grade traceability, laser engraving delivers precision and permanence without physical contact. Whether you work in luxury, medical devices, electronics, or aerospace, our engraving solutions combine sharp resolution with clean, controlled results.

Marking

Laser marking enables fast, clean, and durable inscription across a wide range of materials. Whether you need high-contrast codes, discrete internal markings, or tamper-proof branding, our systems deliver uncompromising quality – without contact, additives, or post-processing.

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