Laser Lift-Off (LLO) with Excimer technology enables the clean, precise separation of thin functional layers from transparent substrates – ideal for flexible electronics, displays, and microfabrication.
Industries served
Luxury
Crafting perfection for the world’s most iconic brands.
MedTech
Enabling life-saving technologies through unmatched laser precision.
Electronics
Powering performance, repeatability, and miniaturization at scale.
Aerospace & Defense
Enabling lighter, stronger, and smarter components for mission-critical performance.
Research & Academics
Enabling breakthroughs in science and education.
Separate cleanly, without damage
Laser debonding (LLO) uses UV lasers to lift off layers without contact, chemicals, or heat damage to the substrate.
Clean separation of thin layers (e.g. polymers, films)
No mechanical stress or residue
Ideal for transparent substrates like glass
Supports flexible and hybrid component design
From words to action
Where Debonding Drives Results
Precise separation enables innovation in materials and device assembly.
The right tools for high-impact results
Our UV laser systems and motion modules enable clean, controlled debonding with repeatable precision.
Discover our machines
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